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CAMBRIDGE, Mass. — HyperLight Corporation (“HyperLight”), creator of the TFLN Chiplet™ Platform, today announced the availability of 400G-per-lane thin-film lithium niobate (TFLN) photonic integrated circuits (PICs) designed for next-generation AI networking infrastructure. The new PIC family delivers low insertion loss, low drive voltage operation, and exceptional electro-optic bandwidth, enabling energy-efficient and high-performance 400G-per-lane optical links.
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The transition to 400G-per-lane is a critical step for future AI infrastructure, enabling higher interconnect bandwidth and improved system density. HyperLight’s 400G-per-lane TFLN PICs provide the large electro-optic bandwidth and low-voltage operation required to support these next-generation optical links, where bandwidth, signal integrity, and power efficiency are increasingly challenging for electronic ICs to sustain.
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HyperLight’s TFLN devices combine high modulation efficiency with extremely low optical loss, enabling transmitter architectures powered by single- or dual-laser configurations. The devices are manufactured using HyperLight’s TFLN Chiplet™ Platform, designed for scalable production of high-performance TFLN photonic devices.
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“400G-per-lane is a prime example of where the advantages of TFLN become clear,” said Mian Zhang, CEO of HyperLight. “While 400G-per-lane pushes the limits of many technologies from a bandwidth perspective, TFLN provides ample bandwidth margin while maintaining low drive voltage. This enables excellent manufacturability while significantly reducing module power.”
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“As the industry moves toward the 400G-per-lane era, the performance of optical components becomes increasingly critical,” said Vijay Janapaty, Vice President and General Manager of Broadcom’s Physical Layer Products Division. “HyperLight’s high-bandwidth TFLN transmitter PIC, combined with Broadcom’s Taurus™ DSP platform, enables exceptional signal integrity and energy efficiency for next-generation optical interconnects.”
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“HyperLight’s TFLN solution plays an important role in enabling high-performance and power-efficient 400G-per-lane optical transceivers,” said Richard Huang, CEO of Eoptolink. “The superior performance of the TFLN PIC reduces the need for dedicated external drivers, lowers laser count, and simplifies module integration — ultimately improving power efficiency, cost, and reliability.”
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About HyperLight
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HyperLight delivers high-performance integrated photonics solutions based on thin-film lithium niobate technology. The company combines the electro-optic advantages of TFLN with scalable manufacturing, test, and integration to enable next-generation optical engines for AI data centers, telecom and metro networks, and emerging photonics markets.
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